High density PCB appear to be at the top of the list when advanced PCB are discussed.
Projects continue to get more complex and the consumer expects the size of its products
to decrease which drives the need for circuit boards that are more densely populated.
Designers are forced to packing more and more circuitry into less and less space.
This creates significant challenges for fabricators.
HDI technology Benefit:
- Provides the possibility to have a via hole connect direct in the SMD or BGA pad.
- Improved signal integrity because of reduced track length.
- Improved possibility to maximization of ground connections.
- Opportunities of better thermal enhancement.
- Improved reliability by stepping up technology rather than compromising existing design rules
Advantech Technical Highlights:
- Layers count: up to 22
- Min Line width/spacing(mil): 2.5/2.5
- Min laser via hole: 0.05
- Via construction: Laser via 3+n+3, Copper pillar 4+n+4